Design for Manufacturability
Produktinformationen "Design for Manufacturability"
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
| Autor: | Balasinski, Artur |
|---|---|
| ISBN: | 9781493943425 |
| Verlag: | Springer US |
| Auflage: | 1 |
| Sprache: | Englisch |
| Seitenzahl: | 278 |
| Produktart: | Kartoniert / Broschiert |
| Erscheinungsdatum: | 23.08.2016 |
| Verlag: | Springer US |
| Untertitel: | From 1D to 4D for 90–22 nm Technology Nodes |
| Schlagworte: | 3D Design for manufacturability 22nm technology node DFM DFM Design for manufacturability Integrated Circuits Memory Design for manufacturability System in Package System on Chip X-fab manufacturability quality control, reliability, safety and risk |
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